Structural Response of Nano-scale Damascene Copper Lines to Annealing
نویسندگان
چکیده
منابع مشابه
Copper voids improvement for the copper dual damascene interconnection process
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ژورنال
عنوان ژورنال: Electrochemistry
سال: 2013
ISSN: 1344-3542,2186-2451
DOI: 10.5796/electrochemistry.81.616